ジャーナル論文 MOCVD‐Grown MoS 2 Wafers as a Transfer‐Free Platform for Top‐Gate Devices via Dry Interface Engineering
Shuhong Li (author) (この著者で検索)
;
Juiteng Chang (author) (この著者で検索)
;
Keisuke Atsumi (author) (この著者で検索)
;
Kosei Matsumoto (author) (この著者で検索)
;
Itsuki Tanaka (author) (この著者で検索)
;
Tomonori Nishimura (author) (この著者で検索)
;
Kaito Kanahashi (author) (この著者で検索)
; ORCID SAMURAI ;
Jun Nara (author) (この著者で検索)
;
Yoshiki Sakuma (author) (この著者で検索)
;
Emi Kano (author) (この著者で検索)
;
Nobuyuki Ikarashi (author) (この著者で検索)
;
Kosuke Nagashio (author) (この著者で検索)
ORCID
コレクション

引用
Shuhong Li, Juiteng Chang, Keisuke Atsumi, Kosei Matsumoto, Itsuki Tanaka, Tomonori Nishimura, Kaito Kanahashi, Takahiro Nagata, Jun Nara, Yoshiki Sakuma, Emi Kano, Nobuyuki Ikarashi, Kosuke Nagashio. MOCVD‐Grown MoS 2 Wafers as a Transfer‐Free Platform for Top‐Gate Devices via Dry Interface Engineering. Advanced Materials. 2026, (), e73931. https://doi.org/10.1002/adma.73931

説明:

(abstract)

We uncover the electronic origin of hidden interfacial doping in monolayer MoS2 single crystal wafers grown on sapphire by metal–organic chemical vapor deposition (MOCVD) and establish a transfer-free top-gate device platform. Despite structural perfection, as-fabricated devices exhibit degenerate electron doping and lack a clear off state. Hall measurements quantify an interfacial electron density of 2.7×1012 cm−2, evidencing substantial charge transfer across the nominal van der Waals interface. Interface-sensitive spectroscopy, lateral force microscopy, and thermal desorption analysis reveal a buried sulfate-derived layer accompanied by a water-like interfacial structure that acts as an intrinsic electron donor. A purely dry H2/Ar annealing process selectively removes these species, suppressing charge transfer and restoring intrinsic FET characteristics without transfer or wet processing. Through this dry interface engineering approach, we demonstrate MOCVD-grown single-crystal MoS2 wafers as a robust, transfer-free platform for the reliable evaluation of intrinsic gate stacks and device performance.

権利情報:

キーワード: MOCVD-grownMoS2wafers, interfacialchargetransfer, transfer-freedevicefabrication, top-gatefield-effecttransistors, wafer-scale2Dsemiconductors

刊行年月日: 2026-07-05

出版者: Wiley

掲載誌:

  • Advanced Materials (ISSN: 09359648) e73931

研究助成金:

  • JST JPMJCR24A3 (CREST: funding program for team-oriented research with the aim of achieving the strategic goals set forth by the government.)
  • JST JPMJES2531 (JST-Research and Devel-opment Programfor Next-generation Edge AI Semiconductors)
  • JST JPMJMI22708192 (JST-Mirai: funding program for high-risk but high-return R&D that leads to social and economic impact.)

原稿種別: 出版者版 (Version of record)

MDR DOI:

公開URL: https://doi.org/10.1002/adma.73931

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更新時刻: 2026-07-29 09:15:47 +0900

MDRでの公開時刻: 2026-07-29 10:28:02 +0900

ファイル名 サイズ
ファイル名 Advanced Materials - 2026 - Li - MOCVD‐Grown MoS2 Wafers as a Transfer‐Free Platform for Top‐Gate Devices via Dry Interface.pdf
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ファイル名 adma73931-sup-0001-suppmat.pdf (サムネイル)
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