manuscript-20240216 R3.docx

Dataset: Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

Filename: manuscript-20240216 R3.docx (Thumbnail) Download

Content type: application/vnd.openxmlformats-officedocument.wordprocessingml.document

Size: 2.09 MB

Checksum: 1b8c3f4d0b0a2b68bec9d27e586fd7ba

Back