Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

論文

著者

Kongping Wu ; Leng Zhang ; Fangzhen Li ; Liwen Sang ; Meiyong Liao ; Kun Tang ; Jiandong Ye ; Shulin Gu

キーワード

Diamond, thermal conductivity, Cu

刊行年月日

2024-03-05

更新時刻

2026-03-06 16:30:04 +0900