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Keyword: Hybrid bonding
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Surface Modification for High Reliability and Reversible Hybrid Interconnection
Poster
Creator
Akitsu Shigetou
Keyword
Hybrid bonding
,
Cu
,
Solid state debonding
Date published
Updated at
2026-01-21 09:20:22 +0900
Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections
Presentation
Creator
Akitsu Shigetou
Keyword
Low temperature bonding
,
Electronics packaging
,
VUV
,
Hybrid bonding
Date published
Updated at
2026-01-20 17:12:48 +0900
Keyword
Hybrid bonding
(2)
Cu
(1)
Electronics packaging
(1)
Low temperature bonding
(1)
Solid state debonding
(1)
VUV
(1)
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