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説明:

Direct printing of flexible Cu traces is one of the most promising additive manufacturing technologies in advanced electronics because it is a cost-effective and environmentally friendly process. However, the low oxidation resistance of Cu is currently a critical issue for the preparation of high-performance metallic inks and the manufacturing of reliable printed traces. Herein, we propose a hybrid ink containing Cu/Ni complexes and Cu particles that can be directly printed onto polyimide substrates to generate high-performance Cu–Ni alloy traces by low-temperature preheating and intense pulsed-light irradiation. The nanoparticles in-situ formed by the decomposition of the complexes effectively bridge the interfaces among Cu particles, allowing the printed traces after subsequent intense pulsed-light irradiation to achieve a low resistivity of 29.4 μΩ·cm and excellent mechanical stability at a bending radius of 7 mm. Strikingly, the obtained Cu–Ni alloy traces achieve multiscale core–shell structures because of the heterogeneous nucleation and passivation of Ni, which enables the printed traces to maintain high conductivity and oxidation resistance even at 250 °C in the air, showing strong potential for use in advanced electronics manufacturing.

権利情報:

• Creative Commons BY-NC-ND Attribution-NonCommercial-NoDerivs 4.0 International
  

キーワード: printed electronics, cupper, nickel, flexible electronics

刊行年月日: 2023-11-20

出版者: Elsevier BV

掲載誌:

• Applied Surface Science (ISSN: 01694332) vol. 646 158967

研究助成金:

原稿種別: 著者最終稿 (Accepted manuscript)

MDR DOI: https://doi.org/10.48505/nims.5231

公開URL: https://doi.org/10.1016/j.apsusc.2023.158967

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更新時刻: 2025-11-20 12:30:14 +0900

MDRでの公開時刻: 2025-11-20 08:30:18 +0900