@misc{wanli2023a,
  title = {Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks},
  author = {Wanli Li, Yitian Li, Lingying Li, Haidong Yan, Takeo Minari},
  publisher = {Elsevier BV},
  year = {2023-11-20},
  keywords = {printed electronics, cupper, nickel, flexible electronics}
}