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Mg3(Sb, Bi)2-based compounds have recently attracted intense attention as thermoelectric (TE) materials for power generation and cooling applications because of their high TE performance. The contact interface layers play a crucial role in achieving high conversion efficiency of TE devices. Iron contacts have often been used for the Mg3(Sb, Bi)2 compound, however, a large drawback for device fabrication is their incompatibility with solder. In this study, we developed Cupronickel as a potential new interface contact layer for Mg3(Sb, Bi)2. A crack-free interface with low specific contact resistance of ~5 µΩcm2, enables a maximum conversion efficiency (ηmax) of ~8% for the single-leg Cupronickel /Mg3(Sb, Bi)2/Cupronickel. Additionally, a ηmax of ~7.8% is realized for a 2-pair module of Mg3(Sb, Bi)2 and MgAgSb at a temperature difference (ΔT) of 277 K. The optimization of the Cupronickel contact layer in this study has the potential to enhance the conversion efficiency of Mg3(Sb, Bi)2-based compounds.

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• In Copyright
  

  This document is the unedited Author’s version of a Submitted Work that was subsequently accepted for publication in ACS Applied Energy Materials, copyright © 2024 American Chemical Society after peer review. To access the final edited and published work see https://doi.org/10.1021/acsaem.4c02794.

Keyword: thermoelectric

Date published: 2024-12-23

Publisher: American Chemical Society (ACS)

Journal:

• ACS Applied Energy Materials (ISSN: 25740962) vol. 7 issue. 24 p. 12112-12118

Funding:

• JST-Mirai Program JPMJMI19A1

Manuscript type: Author's version (Submitted manuscript)

MDR DOI: https://doi.org/10.48505/nims.5219

First published URL: https://doi.org/10.1021/acsaem.4c02794

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Updated at: 2024-12-25 16:30:47 +0900

Published on MDR: 2024-12-25 16:30:47 +0900