Publication

Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film Transistors: Utilization of Palladium-Mediated Hydrogen Pathway

MDR Open Deposited

Amorphous oxide semiconductors (AOSs) with low off-currents and processing temperatures offer promising alternative materials for next-generation high-density memory devices. In this work, we report the pioneering use of palladium thin film as a high-efficiency active hydrogen transfer pathway from the outside to the internal contact interface via low-temperature post-annealing in the H2 atmosphere, and the formation of highly conductive metallic interlayer effectively solves the contact issues at the deep internal in devices. The application of this method reduced the contact resistance of Pd electrodes/amorphous indium-gallium-zinc oxide (a-IGZO) thin-film by 2 orders of magnitude, and thereby the mobility of thin-film transistor was increased from 3.2 cm2 V–1 s–1 to nearly 20 cm2 V–1 s–1, preserving an excellent bias stress stability. This technology has wide applicability for the solution of contact resistance issues in oxide semiconductor devices with complex architectures.

First published at
Creator
Keyword
Resource type
Publisher
Date published
  • 22/03/2024
Rights statement
License description
  • Share — copy and redistribute the material in any medium or format for any purpose, even commercially. Adapt — remix, transform, and build upon the material for any purpose, even commercially.
Journal
Manuscript type
  • Version of record (Published version)
Language
Funding reference

Items