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Multi-objective topology optimization of porous microstructure in die-bonding layer of a semiconductor

Description/Abstract:

To enhance semiconductor efficiency, it is imperative to develop a die-bonding material possessing exceptional thermal conductivity and s...

Keyword:

Multi-objective topology optimization, finite element analysis, highthroughput evaluation, microstructure design, and porous microstructure

Resource Type:

Article

Author:

Jiaxin Zhou, Ikumu Watanabe, Weikang Song, Keita Kambayashi, and Ta-Te Chen

Journal:

Science and Technology of Advanced Materials: Methods

Date Uploaded:

12/04/2024