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Filtering by: Author Jiangwei Liu Remove constraint Author: Jiangwei Liu Publisher MDPI Remove constraint Publisher: MDPI Rights Statement Sim Creative Commons BY Attribution 4.0 International Remove constraint Rights Statement Sim: Creative Commons BY Attribution 4.0 International

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Reliable Ohmic Contact Properties for Ni/Hydrogen-Terminated Diamond at Annealing Temperature up to 900 °C

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Ni1
high-temperature1
hydrogen-terminated diamond (H-diamond)1
ohmic contact1
specific contact resistance1

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English1

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MDPI[remove]1

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Creative Commons BY Attribution 4.0 International[remove]1

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Bo Da1
Chengming Li1
Jiangwei Liu[remove]1
Jinlong Liu1
Junjun Wei1
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