Martin Markwitz
;
Niall Malone
;
Song Yi Back
(National Institute for Materials Science)
;
Alexander Gobbi
;
Jake Hardy
;
Peter P. Murmu
;
Takao Mori
(National Institute for Materials Science)
;
Ben J. Ruck
;
John V. Kennedy
説明:
(abstract)Oxygen is a ubiquitous contaminant in thin films grown in high vacuum systems, and it plays an important role in the properties of the p-type conductivity of transparent copper(I) iodide (CuI). We study the ambi-ent properties of copper iodide deposited at various partial pressures of oxygen gas. Through a variety of experimental techniques we find that achieving a critical oxygen partial pressure of below 3 × 10−5 mbar is essential for growing stoichiometric and conductive CuI thin films. Notably, we relate the commonly reported copper excess to the presence of oxygen within the CuI films. We study how the presence of oxygen affects the optical and structural properties of CuI. Finally, we infer from transport measurements that oxygen is not a shallow acceptor within CuI, as depositing it anywhere below the critical oxygen partial pressure results in no measurable dependency on the Hall carrier concentration.
権利情報:
キーワード: thermoelectric
刊行年月日: 2024-11-28
出版者: AIP Publishing
掲載誌:
研究助成金:
原稿種別: 出版者版 (Version of record)
MDR DOI:
公開URL: https://doi.org/10.1063/5.0235467
関連資料:
その他の識別子:
連絡先:
更新時刻: 2024-12-09 16:30:46 +0900
MDRでの公開時刻: 2024-12-09 16:30:46 +0900
| ファイル名 | サイズ | |||
|---|---|---|---|---|
| ファイル名 |
Journal of Applied Physics--Oxygen incorporation effects on the structural and thermoelectric properties of copper(I) iodide.pdf
(サムネイル)
application/pdf |
サイズ | 2.48MB | 詳細 |