A high-throughput technique to evaluate the probability distribution of strength of adhesively bonded joints after moisture absorption

論文

著者

Chao Kang ; Ming Ji ; Yu Sekiguchi ; Masanobu Naito ; Chiaki Sato

キーワード

Adhesive joint, high throughput, probability distribution, Weibull distribution, epoxy adhesive, moisture absorption

刊行年月日

2025-01-02

更新時刻

2024-12-17 12:30:37 +0900