Keyword: Electronics packaging

1 record found.

250430 NY S U draft.pdf
Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections
Conference presentation
Creator
Akitsu Shigetou (author) (Search by this author)
Research Center for Materials Nanoarchitectonics (MANA)/Semiconductor Materials Field/Smart Interface Team, National Institute for Materials Science
ORCID SAMURAI
Keyword
Low temperature bonding, Electronics packaging, VUV, Hybrid bonding
Date published
Updated at
2026-01-20 17:12:48 +0900