Keyword: Electronics packaging
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250430 NY S U draft.pdf
Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections
Presentation
Creator
Akitsu Shigetou SAMURAI ORCID
Keyword
Low temperature bonding, Electronics packaging, VUV, Hybrid bonding
Date published
Updated at
2026-01-20 17:12:48 +0900