Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks

論文

著者

Wanli Li ; Yitian Li ; Lingying Li ; Haidong Yan ; Takeo Minari

キーワード

printed electronics, cupper, nickel, flexible electronics

刊行年月日

2023-11-20

更新時刻

2025-11-20 12:30:14 +0900