2 records found.
In Situ-Formed Nano-Cu Pathways in Binders Endowing Pastes High Conductivity with Low Metal Content
- Journal article
- Creator
-
Wanli Li (author) (Search by this author)
https://orcid.org/0000-0003-0271-5782
(unauthenticated)
;
;Pengcheng Rui (author) (Search by this author);Songtang Li (author) (Search by this author)Lingying Li (author) (Search by this author)
;
Takeo Minari (author) (Search by this author)
;
Wendong Yang (author) (Search by this author)
https://orcid.org/0000-0002-4972-3002
(unauthenticated)
;
Su Ding (author) (Search by this author)
https://orcid.org/0000-0002-3427-649X
(unauthenticated)
;
Ke Li (author) (Search by this author) - Keyword
- printed electronics
- Date published
- 2025-06-24
- Updated at
- 2025-07-11 16:30:31 +0900
Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks
- Journal article
- Creator
-
Wanli Li (author) (Search by this author)
https://orcid.org/0000-0003-0271-5782
(unauthenticated)
National Institute for Materials Science
;
;Yitian Li (author) (Search by this author)Lingying Li (author) (Search by this author)National Institute for Materials Science
;
;Haidong Yan (author) (Search by this author)Takeo Minari (author) (Search by this author)National Institute for Materials Science
- Keyword
- printed electronics, cupper, nickel, flexible electronics
- Date published
- 2023-11-20
- Updated at
- 2025-11-20 12:30:14 +0900