Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks

Article

Creator

Wanli Li ; Yitian Li ; Lingying Li ; Haidong Yan ; Takeo Minari

Keyword

printed electronics, cupper, nickel, flexible electronics

Date published

2023-11-20

Updated at

2025-11-20 12:30:14 +0900