Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks

Journal article

Creator

Wanli Li (author) (Search by this author)

https://orcid.org/0000-0003-0271-5782 (unauthenticated)

National Institute for Materials Science

Wanli Li ;

Yitian Li (author) (Search by this author)

Yitian Li ;

Lingying Li (author) (Search by this author)

https://orcid.org/0000-0002-3503-7829

National Institute for Materials Science

NIMS Researchers Directory SAMURAI

Lingying Li ;

Haidong Yan (author) (Search by this author)

Haidong Yan ;

Takeo Minari (author) (Search by this author)

https://orcid.org/0000-0001-7690-221X

National Institute for Materials Science

NIMS Researchers Directory SAMURAI

Takeo Minari

Keyword

printed electronics, cupper, nickel, flexible electronics

Date published

2023-11-20

Updated at

2025-11-20 12:30:14 +0900