File type: application/pdf Keyword: Electronics packaging
Reset all filters

1 record found.

250430 NY S U draft.pdf
Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections
Presentation
Creator
Akitsu Shigetou SAMURAI ORCID
Keyword
Low temperature bonding, Electronics packaging, VUV, Hybrid bonding
Date published
Updated at
2026-01-20 17:12:48 +0900