Thermal Conductivity and Thermal Boundary Resistance of Low–Dielectric Constant Interlayer Dielectrics in Advanced Very Large Scale Integration Interconnects

Journal article

Creator

Tianzhuo Zhan (author) (Search by this author)

Tianzhuo Zhan ;

Chong Zheng (author) (Search by this author)

Chong Zheng ;

Mao Xu (author) (Search by this author)

Mao Xu ;

Zhi Cao (author) (Search by this author)

Zhi Cao ;

Yen-Ju Wu (author) (Search by this author)

https://orcid.org/0000-0003-2647-3407

National Institute for Materials Science

NIMS Researchers Directory SAMURAI

Yen-Ju Wu ;

Yibin Xu (author) (Search by this author)

https://orcid.org/0000-0001-8600-8748

National Institute for Materials Science

NIMS Researchers Directory SAMURAI

Yibin Xu ;

Ryo Yokogawa (author) (Search by this author)

Ryo Yokogawa ;

Atsushi Ogura (author) (Search by this author)

Atsushi Ogura ;

Yanming Xue (author) (Search by this author)

https://orcid.org/0000-0003-1061-229X (unauthenticated)

National Institute for Materials Science

Yanming Xue ;

Haidong Wang (author) (Search by this author)

Haidong Wang ;

Mengjie Song (author) (Search by this author)

Mengjie Song ;

Wei Wang (author) (Search by this author)

Wei Wang ;

Bo Chen (author) (Search by this author)

Bo Chen ;

Takanobu Watanabe (author) (Search by this author)

Takanobu Watanabe ;

Yonggang Jiang (author) (Search by this author)

Yonggang Jiang ;

Huawei Chen (author) (Search by this author)

Huawei Chen ;

Deyuan Zhang (author) (Search by this author)

Deyuan Zhang

Keyword

thermal conductivity, thermal boundary resistance, low-k dielectrics, VLSI interconnects, persistent homology

Date published

2025-09-23

Updated at

2026-04-30 12:01:11 +0900