Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections

プレゼンテーション

著者

Akitsu Shigetou (author) (この著者で検索)

https://orcid.org/0000-0001-7054-3674

National Institute for Materials Science Research Center for Materials Nanoarchitectonics (MANA)/Semiconductor Materials Field/Smart Interface Team

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Akitsu Shigetou

キーワード

Low temperature bonding, Electronics packaging, VUV, Hybrid bonding

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更新時刻

2026-01-20 17:12:48 +0900