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Alternative title: アラミドの錯体化による高誘電率・高耐熱性フィルムの創製

Description:

Polymers such as PVDF, BOPP, PET, and polyimide (PI) are commonly used as dielectric films in capacitors, sensors, and flexible substrates. PI exhibits high heat resistance and mechanical properties, but it has low thermal conductivity and high cost. Conversely, PVDF, BOPP, and PET are low cost and have good processibility, but have relatively low heat resistance. All of these share the common disadvantage of needing significant addition of expensive fillers like titanium oxides to achieve sufficiently high dielectric constant and energy density. Aramid, an organic fiber, possesses excellent toughness and heat resistance due to highly oriented polymer chains forming strong hydrogen bonds, and it has been discovered that deprotonated aramid microfibers can be disassembled to produce nanofiber membranes by reprotonation. This study reports preliminary findings on how coordination of conventional aromatic amide (aramid) fibers with metal ions can produce films with high dielectric properties, heat resistance, and recyclability for application in electronics and other devices.

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• In Copyright
  

Keyword: Aramid, Dielectric, Metal complex

Conference: 第62回秋期講演⼤会 (2025-11-18 - 2025-11-19)

Funding:

• Japan Society for the Promotion of Science KCD109

Manuscript type: Not a journal article

MDR DOI: https://doi.org/10.48505/ims.6060

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Updated at: 2025-12-23 15:36:21 +0900

Published on MDR: 2025-12-24 08:20:06 +0900