Article Thermoelectric Copper Chalcogenides: Low‐Cost, High‐Performance, and Stability Challenges

Xinyuan Wang (National Institute for Materials Science) ; Airan Li SAMURAI ORCID (National Institute for Materials Science) ; Takao Mori SAMURAI ORCID (National Institute for Materials Science)

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Citation
Xinyuan Wang, Airan Li, Takao Mori. Thermoelectric Copper Chalcogenides: Low‐Cost, High‐Performance, and Stability Challenges. cMat. 2025, 2 (3), e70013. https://doi.org/10.1002/cmt2.70013

Description:

(abstract)

Thermoelectric (TE) materials, capable of interconverting heat and electricity, exhibit significant promise for applications in heat harvesting and solid-state cooling. Copper is relatively abundant in the earth’s crust and offers the most favorable abundance-to-price ratio among the elements utilized in TE applications, rendering Cu-based TE technology a promising and sustainable candidate for large-scale applications. Over the past decade, considerable attention has been devoted to Cu-based TE materials. In particular, copper chalcogenides (Cu2Q; Q = S, Se, Te) have attracted special interest due to their outstanding TE performance in the high-temperature range (700–1100 K) 2–6, which significantly outperforms most other representative TE materials. They are reviewed.

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Keyword: thermoelectric

Date published: 2025-07-31

Publisher: Wiley

Journal:

  • cMat vol. 2 issue. 3 e70013

Funding:

Manuscript type: Author's version (Submitted manuscript)

MDR DOI: https://doi.org/10.48505/nims.5979

First published URL: https://doi.org/10.1002/cmt2.70013

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Updated at: 2025-12-10 08:30:19 +0900

Published on MDR: 2025-12-10 08:23:52 +0900

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