論文 From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers

Johanna Byloff ORCID ; Vivek Devulapalli ORCID ; Daniele Casari ORCID ; Thomas E. J. Edwards SAMURAI ORCID ; Claus O. W. Trost ORCID ; Megan J. Cordill ORCID ; Shuhel Altaf Husain ORCID ; Pierre‐Olivier Renault ORCID ; Damien Faurie ORCID ; Barbara Putz ORCID

コレクション

引用
Johanna Byloff, Vivek Devulapalli, Daniele Casari, Thomas E. J. Edwards, Claus O. W. Trost, Megan J. Cordill, Shuhel Altaf Husain, Pierre‐Olivier Renault, Damien Faurie, Barbara Putz. From Mechanics to Electronics: Influence of ALD Interlayers on the Multiaxial Electro‐Mechanical Behavior of Metal–Oxide Bilayers. Advanced Functional Materials. 2025, (), e26343. https://doi.org/10.1002/adfm.202526343

説明:

(abstract)

The applicability of metal-polymer thin films in flexible electronics and space applications is fundamentally limited by the trade-off between mechanical and functional performance. This study shows how atomic layer deposited (ALD) amorphous AlOxHy interlayers (0–25 nm) directly control the electro-mechanical functionality of sputter-deposited aluminum films on polyimide substrates. Using uni- and equi-biaxial tensile testing with in situ XRD and electrical resistance measurements, it is demonstrated that interlayer thickness determines both deformation mechanisms and electrical strain limits. Adding an ALD layer between the polymer substrate and the metal thin film significantly improves the deformability of the system. While a single ALD cycle enhances ductility, surprisingly a 1 nm AlOxHy interlayer causes early electrical failure. Optimal performance—improved ductility, delayed cracking, and maintained electrical conductivity under large deformation—is achieved at 5–10 nm interlayer thickness. Beyond this range, embrittlement causes early electrical failure through oxide-initiated cracking. The work establishes quantitative design rules linking the nanoscale interface structure to macroscale electro-mechanical performance, enabling flexible electronics with tailored mechanical properties and enhanced electrical functionality. These findings provide a direct pathway from fundamental interface engineering to high-performance flexible devices operating under multi-axial deformation.

権利情報:

キーワード: atomic layer deposition, electromechanical properties, flexible polymer substrates, tensile testing, thin films

刊行年月日: 2025-11-27

出版者: Wiley

掲載誌:

  • Advanced Functional Materials (ISSN: 1616301X) e26343

研究助成金:

  • Helmholtz-Zentrum Berlin für Materialien und Energie 231‐11757‐ST
  • Schweizerischer Nationalfonds zur Förderung der Wissenschaftlichen Forschung PZ00P2_20208
  • Amt der Steiermärkischen Landesregierung SPM‐PN 3022
  • H2020 Marie Skłodowska-Curie Actions 840222
  • Japan Society for the Promotion of Science 24K23036

原稿種別: 出版者版 (Version of record)

MDR DOI:

公開URL: https://doi.org/10.1002/adfm.202526343

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更新時刻: 2026-01-20 11:54:44 +0900

MDRでの公開時刻: 2026-01-20 16:21:58 +0900

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