Izuru Miyazaki (Toyota Central R&D Labs. Inc) ; Yumi Masuoka ; Akitoshi Suzumura (Malaysia–Japan International Institute of Technology) ; Shinya Moribe ; Hisaaki Takao ; Mitsutaro Umehara (Department of Applied Chemistry, Graduate School of Engineering, Osaka University)
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(abstract)We synthesized high-heat-resistant adhesives based on metal – organic frameworks owing to their high decomposition temperature and the absence of a glass transition. Heat-resistance tests were performed on adhesive joints consisting of zeolitic imidazolate framework (ZIF)-67-based adhesives and a copper substrate. The as-synthesized ZIF-67-based adhesive exhibited heat resistances at 600 and 700°C in air and nitrogen atmospheres, respectively, comparable to those of conventional high-heat-resistant polymer-based adhesives. The degradation mechanism of the ZIF-67 adhesives was investigated, and their high heat resistance was attributed to the stable existence of the ZIF-67 qtz phase in the adhesive layer at high temperatures without the formation of voids. Thus, adhesives based on ZIF-67 and other metal – organic frameworks can be applied in high-temperature industrial systems.
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Keyword: Metal-organic framework, structural adhesive, heat resistance
Date published: 2024-12-31
Publisher: Taylor & Francis
Journal:
- Science and Technology of Advanced Materials (ISSN: 14686996) vol. 25 2347193
Funding:
Manuscript type: Author's version (Accepted manuscript)
MDR DOI: https://doi.org/10.48505/nims.4500
First published URL: https://doi.org/10.1080/14686996.2024.2347193
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Updated at: 2024-05-08 16:30:31 +0900
Published on MDR: 2024-05-08 16:30:31 +0900
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