Martin Markwitz
;
Peter P. Murmu
;
Song Yi Back
(National Institute for Materials Science)
;
Takao Mori
(National Institute for Materials Science)
;
John V. Kennedy
;
Ben J. Ruck
説明:
(abstract)There is a current lack of commercial p-type counterpart to state of the art n-type transparent conductors. Copper (I) iodide (CuI) is the leading p-type candidate, attracting major attention for promising electrical conductivities, partially by chalcogenide doping (O, S, Se, Te). Such improvements lead to promising future integration of CuI in transparent electronic devices such as thermoelectric generators, thin film transistors, and a hole transport layer in perovskite solar cells. The role of chalcogenide doping in CuI is to improve the carrier concentration in CuI, however, the effect of tellurium is yet to be explored in heavily p-type doped CuI. In this work we investigate the role of tellurium in heavily intrinsically doped p-type CuI. We report the effects of tellurium doping (up to 2.4 % Te) in CuI thin films and study the variation in electrical properties of the material. The point defects introduced by ion implantation; the method used to introduce the tellurium led to a progressive reduction in the films’ work functions from 4.9 eV to 4.5 eV. This effect has major repercussions on the other measured electrical properties, such as the electrical conductivity, which is decreased by 3 orders of magnitude, while the Seebeck coefficient is increased by 80 %. We conduct density functional theory calculations to help explicate the effect of tellurium doping on the valence band structure of CuI. Consequently, this work shows that the Fermi energy in heavily p-type doped CuI can be readily tuned by Te doping.
権利情報:
キーワード: thermoelectric
刊行年月日: 2024-07-14
出版者: Elsevier BV
掲載誌:
研究助成金:
原稿種別: 査読前原稿 (Author's original)
MDR DOI: https://doi.org/10.48505/nims.4808
公開URL: https://doi.org/10.1016/j.mtphys.2024.101513
関連資料:
その他の識別子:
連絡先:
更新時刻: 2024-10-08 16:30:45 +0900
MDRでの公開時刻: 2024-10-08 16:30:45 +0900
| ファイル名 | サイズ | |||
|---|---|---|---|---|
| ファイル名 |
MDR-CuI_Te_implantation_manuscript.docx
(サムネイル)
application/vnd.openxmlformats-officedocument.wordprocessingml.document |
サイズ | 8.44MB | 詳細 |