Wen Zhao
(Research Center for Electronic and Optical Materials/Functional Materials Field/Ultra-wide Bandgap Semiconductors Group, National Institute for Materials Science)
;
Guo Chen
(Research Center for Electronic and Optical Materials/Functional Materials Field/Ultra-wide Bandgap Semiconductors Group, National Institute for Materials Science)
;
Zhaozong Zhang
(Research Center for Electronic and Optical Materials/Functional Materials Field/Ultra-wide Bandgap Semiconductors Group, National Institute for Materials Science)
;
Satoshi KOIZUMI
(Research Center for Electronic and Optical Materials/Functional Materials Field/Ultra-wide Bandgap Semiconductors Group, National Institute for Materials Science)
;
Meiyong Liao
(Research Center for Electronic and Optical Materials/Functional Materials Field/Ultra-wide Bandgap Semiconductors Group, National Institute for Materials Science)
説明:
(abstract)Next-generation thermometric technologies demand exceptional temperature precision combined with microscale to nanoscale spatial resolution, enabling advanced sensing applications in bio-calorimetry, optoelectronic sensing, quantum science, energy storage systems, and thermal management of electronic devices. Existing thermometric techniques based on thermocouples, resistive elements, or optical systems are usually hindered by inherent drawbacks, including bulky configurations, low resolution, high noise susceptibility, and narrow temperature operation ranges. In comparison, thermometry based on microelectromechanical systems (MEMS) offers compelling advantages, such as miniaturization, scalable batch fabrication, and facile integration with electronic circuitry, positioning it as a promising solution for high-performance on-chip thermal sensing. However, mainstream silicon MEMS thermometry often suffers from the trade-off between sensitivity, temperature resolution, and thermal noise, resulting in insufficient sensing precision for high-resolution thermal measurements. To overcome these limitations, in this work, we propose the utilization of high-quality factor single-crystal diamond MEMS cantilevers with multi-mode resonance to address these challenges. The proposed diamond MEMS thermometry achieves unparalleled performance, with an ultra-high temperature resolution of 100 µK, an ultra-high sensitivity of ~22 nK/Hz1/2, and a wide operational temperature range from 6.5K to 380K. These achievements establish diamond MEMS resonators as a versatile and transformative platform for next-generation precision thermal sensing technologies.
権利情報:
会議:
36th International Conference on Diamond and Carbon Materials
(2025-08-31 - 2025-09-04)
研究助成金:
原稿種別: 論文以外のデータ
MDR DOI: https://doi.org/10.48505/nims.6116
公開URL:
関連資料:
その他の識別子:
連絡先:
更新時刻: 2026-01-09 11:00:08 +0900
MDRでの公開時刻: 2026-01-09 12:22:33 +0900
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