Jun Uzuhashi
;
Yoshihiro Irokawa
;
Toshihide Nabatame
;
Yasuo Koide
;
Tadakatsu Ohkubo
Description:
(abstract)Controlling the dielectric/semiconductor interfaces is essential for the development of semiconductor power devices. Gallium nitride (GaN) has attracted significant attention as a next-generation semiconductor owing to its superior properties; however, controlling the dielectric/GaN interface remains a critical challenge unlike silicon (Si). In this study, we observed native oxides formed on both the c-face and m-face GaN surfaces after simple air exposure using scanning transmission electron microscopy. Oxygen diffusion into Si crystal was significantly suppressed by the formation of a SiOx layer; on the other hand, gradual oxygen diffusion (Ga-N-O layer) with ~ 2.0 nm depths into the GaN crystal was observed. Remarkably, 1.5 times larger amount oxygen was incorporated in the m-face than in the c-face GaN. These findings provide key insights into the control of dielectric/GaN interfaces and may facilitate the development of GaN-based power devices.
Rights:
Keyword: transmission electron microscopy, gallium nitride
Date published: 2026-04-01
Publisher: AIP Publishing
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Funding:
Manuscript type: Author's version (Accepted manuscript)
MDR DOI: https://doi.org/10.48505/nims.6241
First published URL: https://doi.org/10.1063/5.0322514
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Updated at: 2026-04-02 10:10:21 +0900
Published on MDR: 2026-04-02 12:25:43 +0900
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