Nobuya Banno
;
Koki Asai
;
Tsuyoshi Yagai
Description:
(abstract)Large-scale devices, such as the next generation high energy particle accelerator project, demand the enhancement of the Jc and cost performance of Nb3Sn wires. We investigated the variations in microstructure and hardness when Cu and Zn were co-added to Sn. Subsequently, we manufactured tube-type multifilamentary wires using subelements containing different types of Sn alloys, with and without an intermediate layer of Cu between Sn and Nb.
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Date published: 2025-02-07
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
Journal:
Funding:
Manuscript type: Author's version (Accepted manuscript)
MDR DOI: https://doi.org/10.48505/nims.6049
First published URL: https://doi.org/10.1109/tasc.2025.3539266
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Updated at: 2025-12-22 13:13:21 +0900
Published on MDR: 2025-12-22 16:22:08 +0900
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