Nobuya Banno
;
Koki Asai
;
Tsuyoshi Yagai
説明:
(abstract)Large-scale devices, such as the next generation high energy particle accelerator project, demand the enhancement of the Jc and cost performance of Nb3Sn wires. We investigated the variations in microstructure and hardness when Cu and Zn were co-added to Sn. Subsequently, we manufactured tube-type multifilamentary wires using subelements containing different types of Sn alloys, with and without an intermediate layer of Cu between Sn and Nb.
権利情報:
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刊行年月日: 2025-02-07
出版者: Institute of Electrical and Electronics Engineers (IEEE)
掲載誌:
研究助成金:
原稿種別: 著者最終稿 (Accepted manuscript)
MDR DOI: https://doi.org/10.48505/nims.6049
公開URL: https://doi.org/10.1109/tasc.2025.3539266
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更新時刻: 2025-12-22 13:13:21 +0900
MDRでの公開時刻: 2025-12-22 16:22:08 +0900
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IEEE-TAS_Nb3Sn-SnCuZn_3MOr2A-07_v6_final-clean.pdf
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サイズ | 808KB | 詳細 |