All-dry flip-over stacking of van der Waals junctions of 2D materials using polyvinyl chloride

Momoko Onodera; Yusai Wakafuji; Taketo Hashimoto; Satoru Masubuchi; Rai Moriya; Yijin Zhang; Kenji Watanabe; Takashi Taniguchi; Tomoki Machida

doi:10.1038/s41598-022-26193-z

Article All-dry flip-over stacking of van der Waals junctions of 2D materials using polyvinyl chloride

Momoko Onodera ; Yusai Wakafuji ; Taketo Hashimoto ; Satoru Masubuchi ; Rai Moriya ; Yijin Zhang ; Kenji Watanabe (National Institute for Materials Science) ; Takashi Taniguchi (National Institute for Materials Science) ; Tomoki Machida

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Momoko Onodera, Yusai Wakafuji, Taketo Hashimoto, Satoru Masubuchi, Rai Moriya, Yijin Zhang, Kenji Watanabe, Takashi Taniguchi, Tomoki Machida. All-dry flip-over stacking of van der Waals junctions of 2D materials using polyvinyl chloride. Scientific Reports. 2022, 12 (1), 21963. https://doi.org/10.1038/s41598-022-26193-z

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We demonstrated an all-dry polymer-to-polymer transfer technique for two-dimensional (2D) crystal flakes using a polyvinyl chloride (PVC) layer deposited on a piece of polydimethylsiloxane (PDMS). We found that the 2D flake pickup/release temperatures of the PVC/PDMS stamp could be effectively tuned by varying the thickness of the PVC film, without the requirement to alter its composition. Utilizing the difference in adhesion related to the difference in the pickup/release temperatures, 2D flakes were transferred from a thicker PVC film to a thinner one. This polymer- to-polymer transfer technique can be utilized to flip over van der Waals heterostructures. As a demonstration, we fabricated a mountain-like stacked structure of hexagonal boron nitride flakes using the flip-over stacking technique. Finally, we compared the results of thermomechanical analysis with the pickup/release temperatures of the PVC/PDMS stamp. The PVC was revealed to be at the glass transition and in the viscoelastic flow regimes when the 2D flakes were picked up and dry released, respectively. Our polymer-to-polymer transfer method facilitates flip-over van der Waals stacking in an all-dry manner, expanding the possibility of 2D materials device fabrications.

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