Article Comprehensive elemental screening of solid-solution copper alloys

Kenji Yamaguchi ; Takuya Ishigaki ; Yuki Inoue ; Shuhei Arisawa ; Hirotaka Matsunoshita ; Yuki Ito ; Hiroyuki Mori ; Ken’ichiro Suehiro ; Kazunari Maki ; Kenji Nagata SAMURAI ORCID (National Institute for Materials ScienceROR) ; Masahiko Demura SAMURAI ORCID (National Institute for Materials ScienceROR)

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Kenji Yamaguchi, Takuya Ishigaki, Yuki Inoue, Shuhei Arisawa, Hirotaka Matsunoshita, Yuki Ito, Hiroyuki Mori, Ken’ichiro Suehiro, Kazunari Maki, Kenji Nagata, Masahiko Demura. Comprehensive elemental screening of solid-solution copper alloys. Science and Technology of Advanced Materials: Methods. 2023, 3 (1), 2250704-2250704. https://doi.org/10.1080/27660400.2023.2250704
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(abstract)

A comprehensive elemental screening framework is proposed to predict the solid-solution strengthening and electrical resis­tivity of copper alloys. Electrical resistivities are predicted by first-principles calculations, and a high degree of accuracy is obtained.

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Keyword: Alloy design, Copper alloys, Mechanical properties, Electrical resistivity / conductivity, Density functional theory (DFT)

Date published: 2023-12-31

Publisher: Informa UK Limited

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  • Science and Technology of Advanced Materials: Methods (ISSN: 27660400) vol. 3 issue. 1 p. 2250704-2250704

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Manuscript type: Publisher's version (Version of record)

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First published URL: https://doi.org/10.1080/27660400.2023.2250704

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Updated at: 2024-01-05 22:11:53 +0900

Published on MDR: 2023-11-02 13:30:11 +0900

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