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Description:

A comprehensive elemental screening framework is proposed to predict the solid-solution strengthening and electrical resis­tivity of copper alloys. Electrical resistivities are predicted by first-principles calculations, and a high degree of accuracy is obtained.

Rights:

• Creative Commons BY Attribution 4.0 International
  

Keyword: Alloy design, Copper alloys, Mechanical properties, Electrical resistivity / conductivity, Density functional theory (DFT)

Date published: 2023-12-31

Publisher: Informa UK Limited

Journal:

• Science and Technology of Advanced Materials: Methods (ISSN: 27660400) vol. 3 issue. 1 p. 2250704-2250704

Funding:

Manuscript type: Publisher's version (Version of record)

MDR DOI:

First published URL: https://doi.org/10.1080/27660400.2023.2250704

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Updated at: 2024-01-05 22:11:53 +0900

Published on MDR: 2023-11-02 13:30:11 +0900