論文 Comprehensive elemental screening of solid-solution copper alloys

Kenji Yamaguchi ; Takuya Ishigaki ; Yuki Inoue ; Shuhei Arisawa ; Hirotaka Matsunoshita ; Yuki Ito ; Hiroyuki Mori ; Ken’ichiro Suehiro ; Kazunari Maki ; Kenji Nagata SAMURAI ORCID (National Institute for Materials ScienceROR) ; Masahiko Demura SAMURAI ORCID (National Institute for Materials ScienceROR)

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Kenji Yamaguchi, Takuya Ishigaki, Yuki Inoue, Shuhei Arisawa, Hirotaka Matsunoshita, Yuki Ito, Hiroyuki Mori, Ken’ichiro Suehiro, Kazunari Maki, Kenji Nagata, Masahiko Demura. Comprehensive elemental screening of solid-solution copper alloys. Science and Technology of Advanced Materials: Methods. 2023, 3 (1), 2250704-2250704. https://doi.org/10.1080/27660400.2023.2250704
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説明:

(abstract)

A comprehensive elemental screening framework is proposed to predict the solid-solution strengthening and electrical resis­tivity of copper alloys. Electrical resistivities are predicted by first-principles calculations, and a high degree of accuracy is obtained.

権利情報:

キーワード: Alloy design, Copper alloys, Mechanical properties, Electrical resistivity / conductivity, Density functional theory (DFT)

刊行年月日: 2023-12-31

出版者: Informa UK Limited

掲載誌:

  • Science and Technology of Advanced Materials: Methods (ISSN: 27660400) vol. 3 issue. 1 p. 2250704-2250704

研究助成金:

原稿種別: 出版者版 (Version of record)

MDR DOI:

公開URL: https://doi.org/10.1080/27660400.2023.2250704

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更新時刻: 2024-01-05 22:11:53 +0900

MDRでの公開時刻: 2023-11-02 13:30:11 +0900

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