Somaditya Santra
;
Sankalp Samdariya
;
Shaili Sett
;
Kenji Watanabe
(National Institute for Materials Science)
;
Takashi Taniguchi
(National Institute for Materials Science)
;
Arindam Ghosh
Description:
(abstract)A persistent challenge in transition metal dichalcogenide (TMD)-based transistors is the formation of a Schottky Barrier (SB) at the metal–TMD interface which introduces substantial contact resistance and degrades device performance. Minimizing the barrier height and hence contact resistance—ideally to near-zero—is essential for realizing high-performance 2D material-based field-effect transistors. Here, we present a non-invasive photo doping strategy that leverages ultraviolet irradiation to induce localized n-type doping near the contact region, in hBN/TMD field-effect transistors. This targeted doping with UV exposure significantly reduces the SB, leading to a remarkable improvement in device performance. We demonstrate this with hBN/MoS2 transistors, where we achieve a barrier height reduction of∼100 meV, resulting in a seventy-fold increase in on-state cur- rent and a twenty-fold increase in mobility. We further demonstrate the generality of this approach by applying it to other TMD transistors, such as hBN/MoSe2 and hBN/WSe2 hybrids all of which exhibit similar performance enhancements. These results outline a portable, broadly applicable and scalable contact engineering strategy for next-generation 2D electronic devices.
Rights:
Keyword: transition metal dichalcogenide (TMD) , contact resistance , UV-induced doping
Date published: 2025-12-01
Publisher: AIP Publishing
Journal:
Funding:
Manuscript type: Publisher's version (Version of record)
MDR DOI:
First published URL: https://doi.org/10.1063/5.0292130
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Updated at: 2026-02-17 12:30:24 +0900
Published on MDR: 2026-02-17 09:11:00 +0900
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