Jeyun Yeom (Laboratory for Joining Technologies and Corrosion, Empa, Swiss Federal Laboratories for Materials Science and Technology) ; Giacomo Lorenzin ; Lea Ghisalberti (Malaysia–Japan International Institute of Technology) ; Claudia Cancellieri ; Jolanta Janczak-Rusch (Laboratory for Joining Technologies and Corrosion, Empa, Swiss Federal Laboratories for Materials Science and Technology)
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(abstract)The microstructural evolution of Cu/Mo nanomultilayers upon annealing was investigated by X-ray diffraction and transmission electron microscopy. The isothermal annealing process in the temperature ranges of 300 – 850°C was conducted to understand the thermal behavior of the sample and follow the transformation into a nanocomposite. Annealing at 600°C led to the initiation of grain grooving in the investigated nanomultilayer, and it degraded into a spheroidized nanocomposite structure at 800°C. The sample kept the as-deposited Cu {111}//Mo{110} fiber texture up to 850°C. The residual stress was investigated to explain microstructure changes. The activation energy of degradation kinetics of Cu/Mo nanomultilayers was determined to understand the rate-determining mechanism for the degradation of nanolaminate structures.
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Keyword: Cu/Mo nanomultilayers, Annealing, X-ray diffraction, Fiber texture, Magnetron sputtering
Date published: 2024-12-31
Publisher: Taylor & Francis
Journal:
- Science and Technology of Advanced Materials (ISSN: 14686996) vol. 25 2357536
Funding:
Manuscript type: Author's version (Accepted manuscript)
MDR DOI: https://doi.org/10.48505/nims.4532
First published URL: https://doi.org/10.1080/14686996.2024.2357536
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Updated at: 2024-06-04 08:30:28 +0900
Published on MDR: 2024-06-04 08:30:28 +0900
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The thermal stability and degradation mechanism of Cu Mo nanomultilayers.pdf
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