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We demonstrate a versatile technique for measuring the in-plane thermal conductivity, in-plane thermal diffusivity, and volumetric heat capacity of nanoscale-thick films by means of lock-in thermography. The technique relies on the thermal analyses of the imaged lock-in temperature distribution over the surface of the films generated by an on-chip line heater. This enables simultaneous estimation of the properties for a free-standing membrane or multilayered thin films deposited on the membrane. We validate the usability of the technique by determining the thermophysical properties of Ni films with different nanoscale thicknesses. This technique also enables the measurements under an external magnetic field, facilitating investigating magneto-thermal transport properties. Thus, the proposed approach will be useful for exploring nanoscale thermal transport properties in thin films and thermal management systems.

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  This article may be downloaded for personal use only. Any other use requires prior permission of the author and AIP Publishing. This article appeared in Abdulkareem Alasli, Ryo Iguchi, Ken-ichi Uchida, Hosei Nagano; Measurements of in-plane thermophysical properties on nanoscale-thick films by lock-in thermography. Appl. Phys. Lett. 27 January 2025; 126 (4): 044102 and may be found at https://doi.org/10.1063/5.0245566.

Keyword: Thermal transport, Thin film, Lock-in thermography

Date published: 2025-01-27

Publisher: AIP Publishing

Journal:

• Applied Physics Letters (ISSN: 00036951) vol. 126 issue. 4

Funding:

• Core Research for Evolutional Science and Technology JPMJCR17I1
• Exploratory Research for Advanced Technology JPMJER2201

Manuscript type: Author's version (Accepted manuscript)

MDR DOI: https://doi.org/10.48505/nims.5316

First published URL: https://doi.org/10.1063/5.0245566

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Updated at: 2025-02-10 16:30:28 +0900

Published on MDR: 2025-02-10 16:30:28 +0900