Article Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds

TSAI, Hsing-Ying ; NAKAMURA, Yasuyuki SAMURAI ORCID ; FUJITA, Takehiro ; NAITO, Masanobu SAMURAI ORCID

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TSAI, Hsing-Ying, NAKAMURA, Yasuyuki, FUJITA, Takehiro, NAITO, Masanobu. Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds.
SAMURAI

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(abstract)

Epoxy resins incorporating aromatic disulfide bonds demonstrated improved adhesive properties with increasing temperature below their glass transition points. This behaviour was explained in terms of the relatively low topology freezing transition temperature of these materials as compared with their glass transition temperatures.

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Keyword: adhesive

Date published: 2020-11-21

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Manuscript type: Author's original (Submitted manuscript)

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First published URL: https://doi.org/10.1039/d0ma00714e

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Updated at: 2022-10-03 01:26:15 +0900

Published on MDR: 2021-12-03 01:32:53 +0900

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