論文 Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds

TSAI, Hsing-Ying ; NAKAMURA, Yasuyuki SAMURAI ORCID ; FUJITA, Takehiro ; NAITO, Masanobu SAMURAI ORCID

コレクション

引用
TSAI, Hsing-Ying, NAKAMURA, Yasuyuki, FUJITA, Takehiro, NAITO, Masanobu. Strengthening epoxy adhesives at elevated temperatures based on dynamic disulfide bonds. https://doi.org/10.1039/d0ma00714e
SAMURAI

説明:

(abstract)

Epoxy resins incorporating aromatic disulfide bonds demonstrated improved adhesive properties with increasing temperature below their glass transition points. This behaviour was explained in terms of the relatively low topology freezing transition temperature of these materials as compared with their glass transition temperatures.

権利情報:

キーワード: adhesive

刊行年月日: 2020-11-21

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研究助成金:

原稿種別: 査読前原稿 (Author's original)

MDR DOI:

公開URL: https://doi.org/10.1039/d0ma00714e

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更新時刻: 2022-10-03 01:26:15 +0900

MDRでの公開時刻: 2021-12-03 01:32:53 +0900

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