Xu Yang
(National Institute for Materials Science)
;
Markus Pristovsek
;
Shugo Nitta
;
Yoshio Honda
;
Akihiro Ohtake
(National Institute for Materials Science)
;
Yoshiki Sakuma
(National Institute for Materials Science)
;
Takanobu Hiroto
(National Institute for Materials Science)
;
Takayuki Ishida
;
Michio Ikezawa
;
Qixin Guo
;
Hiroshi Amano
Description:
(abstract)The epitaxy of high-quality hexagonal boron nitride (hBN) multilayers on dielectric wafers is essential for hBN applications but remains challenging. Herein, highly-oriented hBN multilayers grown on single-crystal aluminum nitride (AlN)—AlN on sapphire and bulk AlN substrates—via metalorganic vapor phase epitaxy and high-temperature annealing is reported. Hexagonal AlN (0001) not only provides a crystallographically commensurate base for hBN epitaxy but is thermally stable for hBN annealing up to 1800°C, enabling the first instance of large-area multilayer hBN with both superior out-of-plane and in-plane alignments grown directly on dielectrics using a fully industry-compatible approach. Elevated temperatures also reduce carbon and allow control over the separation of related single photon emission centers in hBN. These centers exhibited a record-narrow wavelength distribution (578 ± 5 nm) with small zero-phonon linewidths down to 1.44 meV, indicating the high uniformity of the achieved multilayer hBN films. This work paves an industry-compatible way towards producing highly-oriented homogeneous hBN multilayers on dielectrics, promising for future device and integration applications.
Rights:
Keyword: Epitaxial BN layers
Date published: 2025-09-29
Publisher: Wiley
Journal:
Funding:
Manuscript type: Publisher's version (Version of record)
MDR DOI:
First published URL: https://doi.org/10.1002/advs.202509354
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Updated at: 2025-12-15 13:40:58 +0900
Published on MDR: 2025-12-18 19:08:21 +0900
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