# Fileset

[manuscript.docx](https://mdr.nims.go.jp/filesets/c6a42ed8-0a31-4428-a5d5-acdbde9165bc/download)

## Creator

[Wanli Li](https://orcid.org/0000-0003-0271-5782), Pengcheng Rui, Songtang Li, [Lingying Li](https://orcid.org/0000-0002-3503-7829), [Takeo Minari](https://orcid.org/0000-0001-7690-221X), [Wendong Yang](https://orcid.org/0000-0002-4972-3002), [Su Ding](https://orcid.org/0000-0002-3427-649X), Ke Li

## Rights

This document is the unedited Author’s version of a Submitted Work that was subsequently accepted for publication in ACS Applied Electronic Materials, copyright © 2025 American Chemical Society after peer review. To access the final edited and published work see https://doi.org/10.1021/acsaelm.5c00471.[In Copyright](http://rightsstatements.org/vocab/InC/1.0/)

## Other metadata

[In Situ-Formed Nano-Cu Pathways in Binders Endowing Pastes High Conductivity with Low Metal Content](https://mdr.nims.go.jp/datasets/3551b6e7-1766-45fe-8ff4-7ae41e186aeb)

## Fulltext