# Fileset

[JAFOE.pdf](https://mdr.nims.go.jp/filesets/c07cb455-ddef-4947-a099-3968305f2ccf/download)

## Creator

[Akitsu Shigetou](https://orcid.org/0000-0001-7054-3674)

## Rights

ポスターコピー不可版[In Copyright](http://rightsstatements.org/vocab/InC/1.0/)

## Other metadata

[Surface Modification for High Reliability and Reversible Hybrid Interconnection](https://mdr.nims.go.jp/datasets/1d263ca8-2bc6-43a9-8b5c-2431cdb7c10b)

## Fulltext

FOE Website - ParticipantsAkitsu ShigetouPrincipal Researcher, Team Leader,Smart Interface Team, Research Center for Materials NanoArchitectonics (MANA),National Institute for Materials Science (NIMS)Shigetou.Akitsu@nims.go.jpKEYWORDSSurface Modification for High Reliabilityand Reversible Hybrid InterconnectionBonding, debonding, low temperature, non-vacuum, hybrid, electronics packagingResults : Reversible bonding for Cu – bonding @ 150℃, waterproof, and solid-state debonding @ -100℃JIEP/IEEE EPS/iMAPS ICEP2024, ADMETA Plus Tutrial 2023 etc.For the ecology and economy of hybrid bonding in E packaging: p Multi-materials compatibility p Non-vacuump Low temp <150°Cp High interfacial reliabilityp Easy solid-state debondingBackground: Reversible Bonding(Left) Concept of seamless hybrid bonding; (Right) Outline of the vapor-assisted VUV surface modification method.Mtr. 2 (Cu )Mtr. 1Bridge layerBridgeComposed of Cu-related compound10nm aroundNucleation of CuO nanoparticles After bondingCooling to below TNStressExpansion of bridge layer Solid-state debondingMtr. 1Mtr. 2 (Cu)Bridge layerAnti-hydrolytic bridge layer:1) Dehydration condensation at the end of the bridge2) Dynamic competition of hydrolysisConcept of IPA-VUV bridge layerCuO nanocrystals: Significant expansion at temperatures below TN (around -100 °C)Methodology: Anti-hydrolytic bridge layer with CuO nanocrystals for easy debonding through coolingp A multidentate carboxylate-carrying bridge layer with self-generating CuO nanocrystalsp Steep expansion of CuO due to the spin-lattice interaction at around -100℃  Concept of an anti-hydrolysis bridge structure utilizing multidentate inorganic carboxylate materialsConcept of a solid-state debonding from the bond interfaceSpin-lattice interaction in antiferromagnetic nanocrystals with a triangular spin configurationConcept of a new solid-state debonding trigger← Pat JP 07597418, PCT 027099← Bridge growth reaches maxRelationship between Exposure and the calculated bridge layer thickness obtained from the curve fitting results of angle-resolved spectra.! = #・$!・"!"Correlation coefficient R > 0.96 Freundlichʼs isotherm equation︓l a, b, c: arbitral coefficientl X: Exposure, Y: Calculated bridge thicknessl Fitted to different isotherm equations ． 1) Langmuir (saturation at monolayer formation)，2) Michaelis–Menten equation (layer growth including chemical reaction inside) ， 3) Freundlich equation (successive adsorption, only at the top of the layer）• Approximate curve was forced to go 0 when E is 0, assuming that no beidge formation at E=0.• Maximum point was evaluated from different element peaks.  p Easy solid-state debonding: < 20 MPa @ 85℃-85% RH testing ⇒ > 0.4 MPa after cooling @ -100℃p Self-generation and expansion of CuO nanocrystals were confirmed Summary & future challengesResults : Reversible bonding for Cu – bonding @ 150℃, waterproof, and solid-state debonding n Reversible bonding for Cu relating materials were realized with V-VUV methodp Future chip replaceability in Chiplet Packagingp Reliable and cost-effective system integration with various signals, including organic substratesp Batch fabrication process and equipment, from wafer cleaning to bonding