Enhancement of interfacial thermal conductance by introducing carbon vacancy at the Cu/diamond interface

Journal article

Creator

Kongping Wu (author) (Search by this author)

Kongping Wu ;

Leng Zhang (author) (Search by this author)

Leng Zhang ;

Fangzhen Li (author) (Search by this author)

Fangzhen Li ;

Liwen Sang (author) (Search by this author)

https://orcid.org/0000-0003-0946-1025

National Institute for Materials Science

Liwen Sang ;

Meiyong Liao (author) (Search by this author)

https://orcid.org/0000-0003-1361-4266

National Institute for Materials Science

NIMS Researchers Directory SAMURAI

Meiyong Liao ;

Kun Tang (author) (Search by this author)

Kun Tang ;

Jiandong Ye (author) (Search by this author)

Jiandong Ye ;

Shulin Gu (author) (Search by this author)

Shulin Gu

Keyword

Diamond, thermal conductivity, Cu

Date published

2024-03-05

Updated at

2026-03-06 16:30:04 +0900