Atomic Layer-Deposited Interlayers for Robust Metal–Polymer Interfaces

Journal article

Creator

Johanna Byloff (author) (Search by this author)

https://orcid.org/0000-0001-6026-6845 (unauthenticated)

Johanna Byloff ;

Claus Othmar Wolfgang Trost (author) (Search by this author)

https://orcid.org/0000-0002-7570-688X (unauthenticated)

Claus Othmar Wolfgang Trost ;

Vivek Devulapalli (author) (Search by this author)

Vivek Devulapalli ;

Shuhel Altaf Husain (author) (Search by this author)

Shuhel Altaf Husain ;

Damien Faurie (author) (Search by this author)

https://orcid.org/0000-0001-7259-3958 (unauthenticated)

Damien Faurie ;

Pierre-Olivier Renault (author) (Search by this author)

Pierre-Olivier Renault ;

Thomas Edward James Edwards (author) (Search by this author)

https://orcid.org/0000-0002-3089-0062

NIMS Researchers Directory SAMURAI

Thomas Edward James Edwards ;

Megan J. Cordill (author) (Search by this author)

https://orcid.org/0000-0003-1142-8312 (unauthenticated)

Megan J. Cordill ;

Daniele Casari (author) (Search by this author)

https://orcid.org/0000-0003-2113-5070 (unauthenticated)

Daniele Casari ;

Barbara Putz (author) (Search by this author)

Barbara Putz

Keyword

thin films, electromechanical properties, atomic layer deposition, flexible substrates, tensile testing, adhesion

Date published

2025-07-16

Updated at

2025-08-22 09:46:25 +0900