Keyword: Adhesive joint
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2025Kang-JA.pdf
A high-throughput technique to evaluate the probability distribution of strength of adhesively bonded joints after moisture absorption
Journal article
Creator
Chao Kang (author) (Search by this author)
;
Ming Ji (author) (Search by this author)
;
Yu Sekiguchi (author) (Search by this author)
;
Masanobu Naito (author) (Search by this author)
National Institute for Materials Science
ORCID SAMURAI ;
Chiaki Sato (author) (Search by this author)
Keyword
Adhesive joint, high throughput, probability distribution, Weibull distribution, epoxy adhesive, moisture absorption
Date published
2025-01-02
Updated at
2024-12-17 12:30:37 +0900