# Printing flexible Cu–Ni traces with high conductivity and high thermal stability by in-situ formed multiscale core–shell structures in inks

https://mdr.nims.go.jp/datasets/fcdedc88-7ab2-414a-958a-37f152960d57

## File

- [manuscript20221011final.docx](https://mdr.nims.go.jp/filesets/3b586461-bd8a-46db-8d02-6a14f46614ca/download) ([Detail](https://mdr.nims.go.jp/filesets/3b586461-bd8a-46db-8d02-6a14f46614ca.md))

## Id

fcdedc88-7ab2-414a-958a-37f152960d57

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2024-12-26T08:08:37.725606Z

## Updated at

2025-11-20T03:30:14.758155Z

## Published at

2025-11-19T23:30:18.958256Z

## Doi

https://doi.org/10.48505/nims.5231

## First published url

https://doi.org/10.1016/j.apsusc.2023.158967

## Date published

2023-11-20

## Recorded date published

2024-2

## Resource type

journal_article

## Manuscript type

accepted_manuscript

## Collection



## Title

- title: Printing flexible Cu–Ni traces with high conductivity and high thermal stability
    by in-situ formed multiscale core–shell structures in inks
  title_type: original
  lang: en

## Description

- description: Direct printing of flexible Cu traces is one of the most promising
    additive manufacturing technologies in advanced electronics because it is a cost-effective
    and environmentally friendly process. However, the low oxidation resistance of
    Cu is currently a critical issue for the preparation of high-performance metallic
    inks and the manufacturing of reliable printed traces. Herein, we propose a hybrid
    ink containing Cu/Ni complexes and Cu particles that can be directly printed onto
    polyimide substrates to generate high-performance Cu–Ni alloy traces by low-temperature
    preheating and intense pulsed-light irradiation. The nanoparticles in-situ formed
    by the decomposition of the complexes effectively bridge the interfaces among
    Cu particles, allowing the printed traces after subsequent intense pulsed-light
    irradiation to achieve a low resistivity of 29.4 μΩ·cm and excellent mechanical
    stability at a bending radius of 7 mm. Strikingly, the obtained Cu–Ni alloy traces
    achieve multiscale core–shell structures because of the heterogeneous nucleation
    and passivation of Ni, which enables the printed traces to maintain high conductivity
    and oxidation resistance even at 250 °C in the air, showing strong potential for
    use in advanced electronics manufacturing.
  description_type: abstract
  lang: und

## Creator

- name: Wanli Li
  role: author
  orcid: https://orcid.org/0000-0003-0271-5782
  organization: National Institute for Materials Science
- name: Yitian Li
  role: author
- name: Lingying Li
  role: author
  orcid: https://orcid.org/0000-0002-3503-7829
  organization: National Institute for Materials Science
  ror: https://ror.org/026v1ze26
- name: Haidong Yan
  role: author
- name: Takeo Minari
  role: author
  orcid: https://orcid.org/0000-0001-7690-221X
  organization: National Institute for Materials Science
  ror: https://ror.org/026v1ze26

## Contact agent



## Publisher

organization: Elsevier BV

## Managing organization



## Keyword

- subject: printed electronics
  schema: not_defined
- subject: cupper
  schema: not_defined
- subject: nickel
  schema: not_defined
- subject: flexible electronics
  schema: not_defined

## Rights

- identifier: https://creativecommons.org/licenses/by-nc-nd/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo

start_date: 2023-11-20
end_date: 2025-11-20

## Journal

- title: Applied Surface Science
  issn: '01694332'
  volume: '646'
  article_number: '158967'

## Conference



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## Instrument



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## Measurement method



## Specimen



## Chemical composition



## Structure for specimen



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## Fileset

- id: 3b586461-bd8a-46db-8d02-6a14f46614ca
  filename: manuscript20221011final.docx
  content_type: application/vnd.openxmlformats-officedocument.wordprocessingml.document
  size: 3200019
  md5: 2f400f71485764dd1936bcddc6d2f1fd

## Thumbnail

fileset_id: 3b586461-bd8a-46db-8d02-6a14f46614ca
filename: manuscript20221011final.docx