# Fabrication of High Dielectric and Heat-Resistant Films via Aramid Complexation

https://mdr.nims.go.jp/datasets/fb782c2e-6f9a-4c2c-aacd-9f945144138d

## File

- [62-Tanks.pdf](https://mdr.nims.go.jp/filesets/37a3d028-ba6f-4dbf-af4d-09cbe1ba69c6/download) ([Detail](https://mdr.nims.go.jp/filesets/37a3d028-ba6f-4dbf-af4d-09cbe1ba69c6.md))

## Id

fb782c2e-6f9a-4c2c-aacd-9f945144138d

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2025-11-26T05:00:35.503622Z

## Updated at

2025-12-23T06:36:21.773902Z

## Published at

2025-12-23T23:20:06.728715Z

## Doi

https://doi.org/10.48505/ims.6060

## First published url



## Date published



## Recorded date published



## Resource type

conference_presentation

## Manuscript type

na

## Collection



## Title

- title: アラミドの錯体化による高誘電率・高耐熱性フィルムの創製
  title_type: alternative
  lang: ja
- title: Fabrication of High Dielectric and Heat-Resistant Films via Aramid Complexation
  title_type: original
  lang: en

## Description

- description: Polymers such as PVDF, BOPP, PET, and polyimide (PI) are commonly used
    as dielectric films in capacitors, sensors, and flexible substrates. PI exhibits
    high heat resistance and mechanical properties, but it has low thermal conductivity
    and high cost. Conversely, PVDF, BOPP, and PET are low cost and have good processibility,
    but have relatively low heat resistance. All of these share the common disadvantage
    of needing significant addition of expensive fillers like titanium oxides to achieve
    sufficiently high dielectric constant and energy density. Aramid, an organic fiber,
    possesses excellent toughness and heat resistance due to highly oriented polymer
    chains forming strong hydrogen bonds, and it has been discovered that deprotonated
    aramid microfibers can be disassembled to produce nanofiber membranes by reprotonation.
    This study reports preliminary findings on how coordination of conventional aromatic
    amide (aramid) fibers with metal ions can produce films with high dielectric properties,
    heat resistance, and recyclability for application in electronics and other devices.
  description_type: abstract
  lang: eng

## Creator

- name: タンクス ジョナサン デビッド
  role: author
  orcid: https://orcid.org/0000-0002-0232-8240
  organization: National Institute for Materials Science
  department: Research Center for Structural Materials/Materials Manufacturing Field/Polymer
    Matrix Composites Group
- name: 田村 堅志
  role: author
  orcid: https://orcid.org/0000-0001-6578-0923
  organization: National Institute for Materials Science
  department: Research Center for Electronic and Optical Materials/Functional Materials
    Field/Environmental Circulation Composite Materials Group

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## Keyword

- subject: Aramid
  schema: not_defined
- subject: Dielectric
  schema: not_defined
- subject: Metal complex
  schema: not_defined

## Rights

- identifier: http://rightsstatements.org/vocab/InC/1.0/

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## Data origin



## Embargo



## Journal



## Conference

name: 第62回秋期講演⼤会
start_date: 2025-11-18
end_date: 2025-11-19
identifier: https://jems1962.org/62nd_autumn_conference/

## Related item



## Funding

- identifier: KCD109
  funder_name: Japan Society for the Promotion of Science

## Instrument



## Instrument operator



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## Measurement method



## Specimen



## Chemical composition



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## Fileset

- id: 37a3d028-ba6f-4dbf-af4d-09cbe1ba69c6
  filename: 62-Tanks.pdf
  content_type: application/pdf
  size: 246100
  md5: 2f0ad55310c4ab53b45d437db7f51c47

## Thumbnail

fileset_id: 37a3d028-ba6f-4dbf-af4d-09cbe1ba69c6
filename: 62-Tanks.pdf