# Electrodeposited copper film data

https://mdr.nims.go.jp/datasets/e8184681-d3e3-47d8-860e-53e79503a36b

## Files

- [electrodeposited copper film data.zip](https://mdr.nims.go.jp/filesets/187ecfa2-871f-4113-82e4-425eb8c843af/download) ([Detail](https://mdr.nims.go.jp/filesets/187ecfa2-871f-4113-82e4-425eb8c843af.md))

## Id

e8184681-d3e3-47d8-860e-53e79503a36b

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2024-04-06T01:20:17.523650Z

## Updated at

2024-10-30T07:30:48.196421Z

## Published at

2024-10-30T07:30:48.326620Z

## Doi

https://doi.org/10.48505/nims.4473

## First published url



## Date published



## Recorded date published



## Resource type

dataset

## Manuscript type

na

## Collection



## Title

- title: Electrodeposited copper film data
  title_type: original
  lang: en

## Description

- description: The five types of surface roughness of the electroplated copper films
    was measured using a white light interferometer (Ametek). Each electrodeposited
    copper film was obtained via constant-current electrolysis in copper sulfate bath.
    The concentrations of sulfuric acid (H2SO4) and copper sulfate (CuSO4) were in
    the ranges of 20–180 g/L and 140–220 g/L, respectively. Standard additives for
    copper sulfate bath (JCU, CU-BRITE_RF) and 50 ppm chloride ions were introduced
    into the bath to ensure the stable formation of the electrodeposited copper film.
    A 70 mm × 70 mm sized masked copper plate was used as the working electrode and
    a Ti-coated mesh was used as the counter electrode. The electrodeposition time
    was controlled such that the total capacity was 8.1 C/cm2.
  description_type: abstract
  lang: en

## Creator

- name: Ryo Tamura
  role: author
  organization: National Institute for Materials Science
- name: Ryuichi Inaba
  role: author
  organization: Mitsubishi Materials Corporation
- name: Mami Watanabe
  role: author
  organization: Mitsubishi Materials Corporation
- name: Yutaro Mori
  role: author
  organization: Mitsubishi Materials Corporation
- name: Makoto Urushihara
  role: author
  organization: Mitsubishi Materials Corporation
- name: Kenji Yamaguchi
  role: author
  organization: Mitsubishi Materials Corporation
- name: Shoichi Matsuda
  role: author
  organization: National Institute for Materials Science

## Contact agent



## Publisher

organization: Informa UK Limitedの予定

## Managing organization



## Keyword

- subject: Electrodeposition, copper film
  schema: not_defined

## Rights



## Other identifier(s)



## Data origin

- data_origin_type: other

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## Instrument



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## Measurement method



## Specimen



## Chemical composition



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## Fileset

- id: 187ecfa2-871f-4113-82e4-425eb8c843af
  filename: electrodeposited copper film data.zip
  content_type: application/zip
  size: 761507
  md5: 7d095696b02adcc88b6bca12a5b41d6c

## Thumbnail

fileset_id: 187ecfa2-871f-4113-82e4-425eb8c843af
filename: electrodeposited copper film data.zip