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The five types of surface roughness of the electroplated copper films was measured using a white light interferometer (Ametek). Each electrodeposited copper film was obtained via constant-current electrolysis in copper sulfate bath. The concentrations of sulfuric acid (H2SO4) and copper sulfate (CuSO4) were in the ranges of 20–180 g/L and 140–220 g/L, respectively. Standard additives for copper sulfate bath (JCU, CU-BRITE_RF) and 50 ppm chloride ions were introduced into the bath to ensure the stable formation of the electrodeposited copper film. A 70 mm × 70 mm sized masked copper plate was used as the working electrode and a Ti-coated mesh was used as the counter electrode. The electrodeposition time was controlled such that the total capacity was 8.1 C/cm2.

データの性質: other

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キーワード: Electrodeposition, copper film

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出版者: Informa UK Limitedの予定

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原稿種別: 論文以外のデータ

MDR DOI: https://doi.org/10.48505/nims.4473

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更新時刻: 2024-10-30 16:30:48 +0900

MDRでの公開時刻: 2024-10-30 16:30:48 +0900