Ryo Tamura (National Institute for Materials Science) ; Ryuichi Inaba (Mitsubishi Materials Corporation) ; Mami Watanabe (Mitsubishi Materials Corporation) ; Yutaro Mori (Mitsubishi Materials Corporation) ; Makoto Urushihara (Mitsubishi Materials Corporation) ; Kenji Yamaguchi (Mitsubishi Materials Corporation) ; Shoichi Matsuda (National Institute for Materials Science)
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(abstract)The five types of surface roughness of the electroplated copper films was measured using a white light interferometer (Ametek). Each electrodeposited copper film was obtained via constant-current electrolysis in copper sulfate bath. The concentrations of sulfuric acid (H2SO4) and copper sulfate (CuSO4) were in the ranges of 20–180 g/L and 140–220 g/L, respectively. Standard additives for copper sulfate bath (JCU, CU-BRITE_RF) and 50 ppm chloride ions were introduced into the bath to ensure the stable formation of the electrodeposited copper film. A 70 mm × 70 mm sized masked copper plate was used as the working electrode and a Ti-coated mesh was used as the counter electrode. The electrodeposition time was controlled such that the total capacity was 8.1 C/cm2.
Data origin type: other
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Keyword: Electrodeposition, copper film
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Publisher: Informa UK Limitedの予定
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Manuscript type: Not a journal article
MDR DOI: https://doi.org/10.48505/nims.4473
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Updated at: 2024-10-30 16:30:48 +0900
Published on MDR: 2024-10-30 16:30:48 +0900
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electrodeposited copper film data.zip
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