# Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections

https://mdr.nims.go.jp/datasets/cd2921d4-af74-462b-a335-27724c2e0637

## File

- [250430 NY S U draft.pdf](https://mdr.nims.go.jp/filesets/58748383-b9cd-4151-abc7-a9fcf758de18/download) ([Detail](https://mdr.nims.go.jp/filesets/58748383-b9cd-4151-abc7-a9fcf758de18.md))

## Id

cd2921d4-af74-462b-a335-27724c2e0637

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2026-01-19T05:00:13.666054Z

## Updated at

2026-01-20T08:12:48.709296Z

## Published at

2026-01-20T23:21:32.845716Z

## Doi

https://doi.org/10.48505/nims.6154

## First published url



## Date published



## Recorded date published



## Resource type

conference_presentation

## Manuscript type

na

## Collection



## Title

- title: Surface Modification for High-Reliability and Multi-Functional Hybrid Interconnections
  title_type: original
  lang: en

## Description

- description: 最新の半導体システムデザインであるChiplet PackagingやCompute - in- Memoryにおいて機能ブロック間の伝送速度および混載化は必須の要望である．そのためには現行のBack
    End Of Line (BEOL)で用いられているバンプレス接続を配線材料だけではく，絶縁層にまで拡張し，数十nm - umレベルまでの機械的接続を一括して実施できるプロセス開発が必須である．本講義では，そのための要素技術とそれを支配する基礎理論を解説した．
  description_type: abstract
  lang: eng

## Creator

- name: Akitsu Shigetou
  role: author
  orcid: https://orcid.org/0000-0001-7054-3674
  organization: National Institute for Materials Science
  department: Research Center for Materials Nanoarchitectonics (MANA)/Semiconductor
    Materials Field/Smart Interface Team

## Contact agent



## Publisher



## Managing organization



## Keyword

- subject: Low temperature bonding
  schema: not_defined
- subject: Electronics packaging
  schema: not_defined
- subject: VUV
  schema: not_defined
- subject: Hybrid bonding
  schema: not_defined

## Rights

- identifier: http://rightsstatements.org/vocab/InC/1.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal



## Conference

name: State University of New York Guest Lecture
start_date: 2025-04-30
end_date: 2025-04-30

## Related item



## Funding



## Instrument



## Instrument operator



## Instrument managing organization



## Measurement method



## Specimen



## Chemical composition



## Structure for specimen



## Structural feature for specimen



## Specific property for specimen



## Process for specimen treatment



## Computational method



## Energy level/transition state



## Software



## Custom property



## Fileset

- id: 58748383-b9cd-4151-abc7-a9fcf758de18
  filename: 250430 NY S U draft.pdf
  content_type: application/pdf
  size: 2402312
  md5: b209b8310c8d8c4415165b94673c5108

## Thumbnail

fileset_id: 58748383-b9cd-4151-abc7-a9fcf758de18
filename: 250430 NY S U draft.pdf