Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish

Kristine L. Haley; Jeffrey A. Cloninger; Kayla Cerminara; Randy M. Sterbentz; Takashi Taniguchi; Kenji Watanabe; Joshua O. Island

doi:10.3390/nanomanufacturing1010005

論文 Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish

Kristine L. Haley ; Jeffrey A. Cloninger ; Kayla Cerminara ; Randy M. Sterbentz ; Takashi Taniguchi (National Institute for Materials Science) ; Kenji Watanabe (National Institute for Materials Science) ; Joshua O. Island

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Kristine L. Haley, Jeffrey A. Cloninger, Kayla Cerminara, Randy M. Sterbentz, Takashi Taniguchi, Kenji Watanabe, Joshua O. Island. Heated Assembly and Transfer of Van der Waals Heterostructures with Common Nail Polish. Nanomanufacturing. 2021, 1 (1), 49-56. https://doi.org/10.3390/nanomanufacturing1010005

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(abstract)

We present here a simple technique to assemble and transfer van der Waals heterostructures using common nail polish. Commercially available nail polish acts as a resilient sticky polymer, allowing for the fabrication of complex multi-material stacks without noticeable fatigue and minimal residue after quick cleaning. Directly comparing four commercially available brands of nail polish, we find that one stands out in terms of stability and stacking characteristics. Using this method, we fabricate two top-gated devices and report their electrical properties. Our technique reduces the complexity in assembling clean van der Waals heterostructures based on the proven van der Waals pick up method.

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