# Materials innovation and electrical engineering in X-ray detection

https://mdr.nims.go.jp/datasets/9abc1b99-0a8d-45ce-abd4-f84e46a3b349

## File

- [Manuscript final 0117.docx](https://mdr.nims.go.jp/filesets/0a943691-e248-417f-aa16-0a83ee9854db/download) ([Detail](https://mdr.nims.go.jp/filesets/0a943691-e248-417f-aa16-0a83ee9854db.md))

## Id

9abc1b99-0a8d-45ce-abd4-f84e46a3b349

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2024-10-16T00:39:31.221015Z

## Updated at

2025-02-23T13:51:35.178568Z

## Published at

2025-02-23T13:51:35.353349Z

## Doi

https://doi.org/10.48505/nims.4863

## First published url

https://doi.org/10.1038/s44287-024-00086-x

## Date published

2024-08-22

## Recorded date published



## Resource type

journal_article

## Manuscript type

accepted_manuscript

## Collection



## Title

- title: Materials innovation and electrical engineering in X-ray detection
  title_type: original
  lang: en

## Description

- description: 'X-ray detection is critical for numerous modern applications, including
    medical diagnosis, industrial inspection, security checks, scientific inquiry,
    and space exploration. Recent advances in materials science, electronics, manufacturing,
    and artificial intelligence have greatly propelled this field forward. This review
    examines fundamental principles and recent breakthroughs in X-ray detection and
    imaging technologies, with a focus on the interplay between electrical engineering
    techniques and X-ray-responsive materials. Two primary approaches are highlighted:
    semiconductor-based direct detection and scintillator-based indirect detection.
    These discussions encompass innovations such as photon counting detectors and
    heterojunction phototransistors. A key emphasis lies in elucidating the critical
    contributions of electrical engineering in the development of these cutting-edge
    detectors. This involves considerations such as chemical engineering, circuit
    optimization, and the implementation of image processing algorithms. Subsequent
    sections provide an overview of significant applications, ranging from biomedical
    imaging to resonant X-ray techniques for material analysis, and even nanometer-resolution
    circuit imaging. This review also underscores future research directions, which
    encompass 3D and 4D X-ray imaging sensors, multispectral X-ray imaging and artificial
    intelligence-assisted medical image diagnosis.'
  description_type: abstract
  lang: und

## Creator

- name: Bo Hou
  role: author
  orcid: https://orcid.org/0000-0002-4030-0716
- name: Qiushui Chen
  role: author
  orcid: https://orcid.org/0000-0002-3039-2098
- name: Luying Yi
  role: author
  orcid: https://orcid.org/0000-0002-6542-8425
- name: Paul Sellin
  role: author
  orcid: https://orcid.org/0000-0002-5221-0515
- name: Hong-Tao Sun
  role: author
  orcid: https://orcid.org/0000-0002-0003-7941
- name: Liang Jie Wong
  role: author
- name: Xiaogang Liu
  role: author
  orcid: https://orcid.org/0000-0003-2517-5790

## Contact agent



## Publisher

organization: Springer Science and Business Media LLC

## Managing organization



## Keyword

- subject: Optical materials
  schema: not_defined

## Rights

- description: 'This version of the article has been accepted for publication, after
    peer review (when applicable) and is subject to Springer Nature’s AM terms of
    use, but is not the Version of Record and does not reflect post-acceptance improvements,
    or any corrections. The Version of Record is available online at: https://doi.org/10.1038/s44287-024-00086-x'
  identifier: http://rightsstatements.org/vocab/InC/1.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo

start_date: 2024-08-22
end_date: 2025-02-22

## Journal

- title: Nature Reviews Electrical Engineering
  issn: '29481201'
  volume: '1'
  issue: '10'
  start_page: 639
  end_page: 655

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## Fileset

- id: 0a943691-e248-417f-aa16-0a83ee9854db
  filename: Manuscript final 0117.docx
  content_type: application/vnd.openxmlformats-officedocument.wordprocessingml.document
  size: 11287022
  md5: 220e1a7be4ac8dcc9802faeafef3f406

## Thumbnail

fileset_id: 0a943691-e248-417f-aa16-0a83ee9854db
filename: Manuscript final 0117.docx