# Elemental distribution at diffusion bonding interface of FeAlSi thermoelectric material and Cu

https://mdr.nims.go.jp/datasets/982f556f-64e2-43d6-b7aa-23a13ae48766

## File

- [s40194-025-02220-1.pdf](https://mdr.nims.go.jp/filesets/0ee994f2-4fa8-4312-b97f-b5dbcbf0537f/download) ([Detail](https://mdr.nims.go.jp/filesets/0ee994f2-4fa8-4312-b97f-b5dbcbf0537f.md))

## Id

982f556f-64e2-43d6-b7aa-23a13ae48766

## Local identifier



## Visibility

open_to_public

## State

published

## Created at

2025-11-17T05:12:08.012991Z

## Updated at

2025-11-17T07:30:07.379670Z

## Published at

2025-11-17T07:24:59.545638Z

## Doi



## First published url

https://doi.org/10.1007/s40194-025-02220-1

## Date published

2025-11-17

## Recorded date published



## Resource type

journal_article

## Manuscript type

vor

## Collection



## Title

- title: Elemental distribution at diffusion bonding interface of FeAlSi thermoelectric
    material and Cu
  title_type: original
  lang: en

## Description

- description: Thermoelectric generation is a promising technology for the realization
    of a carbon-neutral society. Many kinds of semiconductors are developed as high
    efficiency thermoelectric materials. For example, some types of silicide semiconductors
    consisting of widely available low-cost elements are known to be promising materials.
    Among them, FeAlSi thermoelectric (FAST) material is a newly developed derivative
    of iron-silicide material that consists of commonly available non-toxic elements.
    This material has an excellent Seebeck coefficient up to temperatures of 500K.
    With thermoelectric device fabrication, soldering is mainly used to connect FAST
    material and metal electrodes. However, this connection is unstable in a medium
    temperature range because the solder melts. Therefore, we investigated the diffusion
    bonding of FAST material and copper plate, which is stable in a medium temperature
    range. In this study, we determine the bonding temperature range that allows successful
    bonding. Furthermore, the elemental distribution at the bonding interface was
    investigated using EPMA. The mutual diffusion of Al and Cu is dominant in the
    diffusion bonding process. Furthermore, the crystalline phases of the bonded joint
    area is investigated using X-ray diffraction. The spectra show that the Fe-Si
    and Cu-Al phases were precipitated in the Cu diffused area of the FAST material.
    These results show that the mutual diffusion and eutectoid reaction of Cu and
    Al contribute to the diffusion bonding process.
  description_type: abstract
  lang: und

## Creator

- name: Susumu Meguro
  role: author
  orcid: https://orcid.org/0000-0001-9247-4091
- name: Yoshiki Takagiwa
  role: author
- name: Takashi Kimura
  role: author
- name: Takanobu Hiroto
  role: author
  orcid: https://orcid.org/0000-0002-6176-5782
- name: Terumi Nakamura
  role: author

## Contact agent



## Publisher

organization: Springer Science and Business Media LLC

## Managing organization



## Keyword

- subject: FeAlSi
  schema: not_defined
- subject: Cu
  schema: not_defined
- subject: Diffusion bonding
  schema: not_defined
- subject: EPMA
  schema: not_defined
- subject: X-ray diffraction
  schema: not_defined
- subject: Eutectoid reaction
  schema: not_defined

## Rights

- identifier: https://creativecommons.org/licenses/by/4.0/

## Other identifier(s)



## Data origin

- data_origin_type: other

## Embargo



## Journal

- title: Welding in the World
  issn: '00432288'

## Conference



## Related item



## Funding



## Instrument



## Instrument operator



## Instrument managing organization



## Measurement method



## Specimen



## Chemical composition



## Structure for specimen



## Structural feature for specimen



## Specific property for specimen



## Process for specimen treatment



## Computational method



## Energy level/transition state



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## Custom property



## Fileset

- id: 0ee994f2-4fa8-4312-b97f-b5dbcbf0537f
  filename: s40194-025-02220-1.pdf
  content_type: application/pdf
  size: 2428868
  md5: f1e1db092ecb26c4f09a63e9e94f14ab

## Thumbnail

fileset_id: 0ee994f2-4fa8-4312-b97f-b5dbcbf0537f
filename: s40194-025-02220-1.pdf